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| TQP770001 Preliminary Data Sheet Bluetooth Two Stage (HBT) Power Amplifier (EDR Compliant) Features Functional Block Diagram * * * * * InGaP HBT Technology Bluetooth v2.0 class 1 systems High Efficiency: 50% @ 21.5dBm EDR (Enhanced Data Rate) Compliant Under EDR modulation, its low AM-AM and AM-PM distortion guarantee high modulation accuracy Will operate under Bluetooth FSK, 8DPSK, and Pi/4-DQPSK modulations Optimized for 50 ohm System Integrated bias controller with a power control (variable gain) function Small 12-pin QFN, 2x2mm module Lead-free 260C RoHS Compliant Full ESD Protection * Product Description The TQP770001 Bluetooth PA is designed on TriQuint's advanced InGaP HBT GaAs technology offering state of the art reliability, temperature stability and ruggedness. The PA is a two-stage design requiring several SMD tuning elements for input and output matching, gain shaping, and bias injection. Features include an integrated bias controller with a power control (variable gain) function. The bias controller also acts to provide temperature compensation. The PA is housed in a 2.0 mm x 2.0 mm 12 pin STSLP package with a grounded back paddle. A recommended drawing is provided in section 4.3.2. This PA is designed to operate in Bluetooth v2.0 class 1 systems. It is also intended to be Enhanced Data Rate (EDR) compliant with Bluetooth v2.0 + EDR specification for both 2 Mbps and 3 Mbps modulation modes. * * * * * Applications * Bluetooth v2.0 + EDR class 1 systems Electrical Specifications Conditions: Vcc = 3.3 V, T = 25C Package Style Parameter Frequency RF transmit power Vctrl=3.3V Gain @ Pin= -10 dBm PAE @ 21.5dBm Min 2.4 19.5 25.0 Typ Max 2.5 Units GHz dBm dB % 21.0 27.0 50 - 12-Pin 2.0x2.0x0.6mm STSLP Package Bottom View For additional information and latest specifications, see our website: www.triquint.com Revision B, Sept. 18, 2006 Preliminary Data Sheet: Subject to change without notice 1 TQP770001 Preliminary Data Sheet Bluetooth Two Stage (HBT) Power Amplifier (EDR Compliant) Absolute Maximum Ratings1 Parameter Power Supply Voltage Power Supply Voltage Bias and reference Voltage Bias power control voltage DC Supply current Storage Temperature Operating Case Temperature Maximum input power Symbol VCC VCC, RF Applied PA_ON (PA_On = Ven = Venable) P_C (Vctrl = P_CTRL) ICC TSTORAGE TC PI Min. -40 -5 Typ/Nom Max. 6 5 5 5 250 85 85 5 Units V V V V mA C C dBm Recommended Operating Conditions Parameter Supply Voltage Reference Voltage PA On PA Off Bias power control voltage Case Operating Temperature P_CTRL (Vctrl) TCASE -40 Symbol VCC PA_ON (Ven) 3.0 0 3.3 0.0 - Vcc 25 +85 3.60 0.4 Volts C Min. 3.0 Typ/Nom 3.3 Max. 3.6 Units Volts Volts Note 1: No damage assuming only one parameter is set at a time with all other parameters set at or below nominal value. For additional information and latest specifications, see our website: www.triquint.com Revision B, Sept. 18, 2006 Preliminary Data Sheet: Subject to change without notice 2 TQP770001 Preliminary Data Sheet Bluetooth Two Stage (HBT) Power Amplifier (EDR Compliant) Electrical Characteristics Conditions: Vcc = Vctrl = Ven = 3.3 V, T = 25C Parameter RF Frequency Gain Operating Temperature Range Minimum RF transmit power Maximum RF transmit power Gain variation over temperature Gain Flatness Harmonics (2nd) Harmonics (3rd) Spurious Input return loss Output return loss 1 dB gain compression Ven = Venable = PA ON Voltage Ven = Venable = PA ON Current Vctrl = Power control voltage Vctrl = Power control current Off-state S21 Supply voltage Vcc Supply current Shutdown current 0 V Vctrl = Ven 0.4 V Vcc = 3.3 V, Ven = Vctrl = 0.4 V 3.0 -27 3.3 110 5 0.0 Depends on external matching 3.0 Pout=20dBm 8 10 -60 9 14 20 3.3 3.6 0.5 3.6 0.5 -15 3.6 150 Vctrl=0.4V Vctrl=3.3 V ; Basic Data Rate -40C to +85C 19.5 21.0 1 0.3 -35 -35 dBc dBc dBc dB dB dBm V mA V mA dB V mA A Pin= -25 dBm Conditions Min. 2.4 25 -40 27 25 85 -25 Typ/Nom Max. 2.5 Units GHz dB C dBm dBm dB For additional information and latest specifications, see our website: www.triquint.com Revision B, Sept. 18, 2006 Preliminary Data Sheet: Subject to change without notice 3 TQP770001 Preliminary Data Sheet Bluetooth Two Stage (HBT) Power Amplifier (EDR Compliant) Pin Out and Assignments Top View (X-ray) Pin # 1 2 3 4 5 6 7 8 9 10 11 12 Back Description NC or GND RF IN NC or GND Vctrl Ven Vcc NC or GND RF OUT/Vcc2 NC or GND GND Vcc NC or GND Paddle ground connection Function No Connect RF input No Connect Amplifier Power/Gain/Current Control Amplifier On/ Off Bias circuit Vcc No Connect RF output and second stage Vcc No Connect Required ground First stage Vcc No Connect Required ground For additional information and latest specifications, see our website: www.triquint.com Revision B, Sept. 18, 2006 Preliminary Data Sheet: Subject to change without notice 4 TQP770001 Preliminary Data Sheet Bluetooth Two Stage (HBT) Power Amplifier (EDR Compliant) Application Circuit Part C1 C2 C3 C4 C5 C6 C7 C8 C9 L1 L2 L3 R1 R2 R3 R4 R5 Description 9.1 pF ceramic cap 0.01uF ceramic cap 1.0uF ceramic cap 33pF ceramic cap 0.01uF ceramic cap 1.0uF ceramic cap 1.0uF ceramic cap 2.2pF ceramic cap 22pF ceramic cap 1.2nH chip inductor 8.2nH chip inductor 1.0 nH chip inductor 11.0 Ohm chip resistor 0.0 Ohm chip resistor 0.0 Ohm chip resistor 0.0 Ohm chip resistor 0.0 Ohm chip resistor Size 201 201 402 201 201 402 402 201 201 201 201 201 201 402 402 402 402 Comment Provides DC block and input matching. Provides low frequency bypass at Vctrl. Provides low frequency bypass at Vcc1. Inter-stage matching, RF choke and RF bypass L1/C4 . Provides low frequency bypass at Venable. Provides low frequency bypass at Vcc. Provides low frequency bypass at Vcc2. Provides output matching circuit C8/L3. Provides Dc blocking. Inter-stage matching, RF choke and RF bypass L1/C4 . Provides RF choke at Vcc2. Provides output matching circuit C8/L3. Provides RF stability. DC jumper. Install to bias Vcc1 independently from Vcc and Vcc2. DC jumper. Install to bias Vcc2 independently from Vcc and Vcc2 DC jumper. Install to connect Vcc1 bias to Vcc. DC jumper. Install to connect Vcc2 bias to Vcc. For additional information and latest specifications, see our website: www.triquint.com Revision B, Sept. 18, 2006 Preliminary Data Sheet: Subject to change without notice 5 TQP770001 Preliminary Data Sheet Bluetooth Two Stage (HBT) Power Amplifier (EDR Compliant) PC Board Layout Recommendations Notes: 1.) Only ground signal traces are allowed directly under the package 2.) Primary dimensions are in millimeters alternate dimensions are in inches. For additional information and latest specifications, see our website: www.triquint.com Revision B, Sept. 18, 2006 Preliminary Data Sheet: Subject to change without notice 6 TQP770001 Preliminary Data Sheet Bluetooth Two Stage (HBT) Power Amplifier (EDR Compliant) Packaging Information Packaging Marking Diagram For additional information and latest specifications, see our website: www.triquint.com Revision B, Sept. 18, 2006 Preliminary Data Sheet: Subject to change without notice 7 TQP770001 Preliminary Data Sheet Bluetooth Two Stage (HBT) Power Amplifier (EDR Compliant) Tape and Reel Information: Carrier Cover and Physical Tape Dimensions: HP VFQFP-N 2x2 CARRIER AND COVER TAPE DIMENSIONS (See note 1) PART CAVITY FEATURE LENGTH WIDTH DEPTH PITCH DISTANCE CAVITY TO PERFORATION BETWEEN LENGTH DIRECTION CENTERLINE CAVITY TO PERFORATION WIDTH DIRECTION COVER TAPE WIDTH CARRIER TAPE WIDTH SYMBOL SIZE (in) SIZE (mm) A0 0.091 2.30 B0 0.091 2.30 K0 0.047 1.20 P1 0.157 4.00 P2 0.079 2.00 F C W 0.138 0.213 0.315 3.50 5.40 8.00 For additional information and latest specifications, see our website: www.triquint.com Revision B, Sept. 18, 2006 Preliminary Data Sheet: Subject to change without notice 8 TQP770001 Preliminary Data Sheet Bluetooth Two Stage (HBT) Power Amplifier (EDR Compliant) NOTES - 1. HP VFQFP-N is the JEDEC nomenclature for the leadless package family defined in MO-220. Equivalent vendor specific nomenclature for packages based on MO-220 include; MLF (AMKOR), MLP (Carsem), SLP (Unisem) , QLP (STATS) , LPCC (ASAT) and others. Reel Physical Dimensions: Reel Dimensions for 8mm Carrier Tape - 7" Reel HP VFQFP-N 2X2 PART FEATURE FLANGE DIAMETER THICKNESS SPACE BETWEEN FLANGE HUB OUTER DIAMETER ARBOR HOLE DIAMETER KEY SLIT WIDTH KEY SLIT DIAMETER 7" Reel SYMBOL SIZE (in) SIZE (mm) A 6.969 177.0 W2 0.559 14.2 W1 0.346 8.8 N 4.016 102.0 C 0.512 13.0 B 0.079 2.0 D 0.787 20.0 For additional information and latest specifications, see our website: www.triquint.com Revision B, Sept. 18, 2006 Preliminary Data Sheet: Subject to change without notice 9 TQP770001 Preliminary Data Sheet Bluetooth Two Stage (HBT) Power Amplifier (EDR Compliant) Tape Length and Label Placement: Empty part cavities at the trailing and leading ends are sealed with cover tape. See EIA 481-1-A Product label, Mfg Label and ESD label are placed on the flange opposite to the sprockets in the carrier tape Reel Quantity: 2,500 units Additional Information 1T This part is compliant with RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electrical and Electronic Equipment). The part is rated Moisture Sensitivity Level 1 at 260C per JEDEC standard IPC/JEDEC J-STD-020. 1 For latest specifications, additional product information, worldwide sales and distribution locations, and information about TriQuint: Web: Hwww.triquint.comH Email: info_wireless@tqs.com Tel: (503) 615-9000 Fax: (503) 615-8902 For technical questions and additional information on specific applications: Email: info_wireless@tqs.com The information provided herein is believed to be reliable; TriQuint assumes no liability for inaccuracies or omissions. TriQuint assumes no responsibility for the use of this information, and all such information shall be entirely at the user's own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. TriQuint does not authorize or warrant any TriQuint product for use in life-support devices and/or systems. Copyright (c) 2006 TriQuint Semiconductor, Inc. All rights reserved For additional information and latest specifications, see our website: www.triquint.com Revision B, Sept. 18, 2006 Preliminary Data Sheet: Subject to change without notice 10 |
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